DCG400SF EMI Shielding XYZ Conductive Foam

Material Features

As low as $283.2/m at 0% APR With paypal_credit

Describe： DCG400SF offers an innovative approach to traditional shielding and grounding by providing X, Y, and Z-axis conductivity, enhancing the shielding effectiveness required to meet the increasing microprocessor speeds of today’s computer, telecommunications, and other electronic equipment. This foam is designed for low-cycling applications such as input/output (I/O) shielding and other non-shear standard connectors

· Excellent z-axia conductivity to provide effective EMI shielding and grounding
· Available with or without conductive PSA
· Halogen free and RoHS in compliance
· Low compression forces and light weight

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TYPICAL APPLICATIONS

· Servers

· Medical equipment

· Desktop computers

· Printers, tablets and smartphones

AVAILABLE OPTIONS

· Standard sheet size: 500x500mm or customized

· With or without 1-side conductive PSA

· Available in sheet / roll or precut finished parts

Property	Metric Value									Test standard
Color		Grey								Visual
PSA Carrier		Conductive Fabric								--
Thickness, mm		0.5	1	1.5	2	2.5	3	3.5	4	--
X-Y axis Resistance		≤0.5	≤0.5	≤0.5	≤0.5	≤0.5	≤0.5	≤0.5	≤0.5	GB/T 30139
Z axis Resistance		≤0.2	≤0.2	≤0.2	≤0.2	≤0.2	≤0.2	≤0.2	≤0.2	ASTM D257
Resistance (Ω)@ compression set	@20%	0.095	0.081	0.085	0.091	0.076	0.067	0.067	0.095
Resistance (Ω)@ compression set	@50%	0.042	0.044	0.039	0.041	0.038	0.034	0.03	0.042
Working temperature		Long duration: -20～70℃; Short period: -40 ～120℃								--
Adhesion strength,kgf/inch		≥1.0								GB/T 2792
Holding force		≥24Hrs								GB/T2792-1998
Shielding Effectiveness		60 dB (10MHZ-3GHZ)								MIL-DTL-83528C